Universal Laser Systems is an innovator in the field of laser engraving, laser cutting and laser marking equipment and the laser material processing systems they manufacture are the products of decades of experience and a commitment to research and development.
Our laser cutting and engraving machines deliver everything you have come to expect from a high quality laser product, including excellent precision, performance and reliability. They also offer several exclusive 'Uniquely Universal' features. These patented, proven laser processing innovations were designed to make laser processing more effective, productive and profitable. You can only get them from Universal Laser Systems. And we're one of their dedicated suppliers!
The VLS2.30DT is a compact and economical platform designed to be an entry level laser machine for starting your laser material processing business. The VLS2.30DT is well suited to prototype development and on-demand production and also makes a capable second machine to handle production overflow. The VLS2.30DT offers a material processing envelope of 406x305x102mm,12,585 cm³and can be equipped with one of 2 laser cartridges, 10 or 30 watts.
The VLS2.30DT comes standard with Laser Interface+™ and a number of additional options are available to enhance your laser processing capabilities. All Universal laser platforms use interchangeable components, giving you the ability to tailor your system to fit your needs.
The desktop VLS3.60DT is small enough to fit on a work surface yet powerful enough to meet the requirements of on-demand production. Used frequently for educational purposes, the VLS3.60DT is also a great choice for starting your laser business. Offering a material processing envelope of 610x305x102 mm, 18,878 cm³, the VLS3.60DT can be equipped with one of five ULS laser cartridges ranging in power from 10-60 watts.
The VLS3.60DT comes standard with Laser Interface+™ and a number of additional options are available to enhance your laser processing capabilities. All Universal laser platforms use interchangeable components, giving you the ability to tailor your
system to fit your needs.
The VLS3.75 is a free-standing platform designed to be the ideal entry point into light-duty manufacturing. The VLS3.75 is also installed in many educational institutions around the world for architecture, product and graphic design, and materials research programs. The VLS3.75 is a single laser platform that offers a choice of six laser cartridges, ranging in power from 10-75 watts. The VLS3.75 offers a material processing envelope of 610x305x229mm, 42,475 cm³.
Standard Uniquely Universal features on the VLS3.75 include Laser Interface+™ and Rapid Reconfiguration™ and a number of additional options are available to enhance your laser processing capabilities. All Universal laser platforms use interchangeable components, giving you the ability to tailor your system to fit your
needs.
Universal's VLS4.75 is a free-standing platform offering a spacious work area and the ability to quickly adjust laser power with our patented Rapid Reconfiguration. Designed and engineered for light manufacturing and prototyping, the VLS4.75 is a single laser platform that offers a choice of six laser cartridges ranging in power from 10-75 watts.
The VLS4.75 offers a material processing envelope of 610x457x229mm, 63,713 cm³. Laser Interface+™ and Rapid Reconfiguration™ are Uniquely Universal features that come standard on the VLS4.75, and a number of additional options are available to enhance your laser processing capabilities. All Universal laser platforms use interchangeable components, giving you the ability to tailor your system to fit your needs.
The largest in the VLS platform line, the VLS6.75 has a wide and deep engraving area that can accommodate a variety of materials. The VLS6.75 offers a choice of six laser cartridges ranging in power from 10-75 watts. The material processing envelope of 810x457x229mm, 84,950 cm³ makes the VLS6.75 a versatile laser engraving solution for most award and sign shops.
In addition to the basic capabilities of the machine, there are a number of patented Uniquely Universal features that are only available from Universal Laser Systems. Laser Interface+™ and Rapid Reconfiguration™ are Uniquely Universal features that come standard on the VLS6.75, and a number of additional options are available to enhance your laser processing capabilities. All Universal laser platforms use interchangeable components, giving you the ability to tailor your system to fit your needs.
The ULTRA X6000 platform offers laser material processing for the widest possible range of materials. It is designed and ideally suited for precision material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs.
The ULTRA X6000 platform has a materials processing envelope of 36 x 24 in (914 x 610 mm), with support for materials with a thickness up to 12 in (305 mm).
Configure the customizable ULTRA X6000 platform with up to three laser sources consisting of two interchangeable CO2 lasers and one fiber laser. When the platform is configured with three lasers, users can take full advantage of MultiWave Hybrid™ technology enabling up to three wavelengths – 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial beam. Each spectral component of the beam is independently controlled and can be modulated in real time.
Major features include multiple laser support, rapid high-accuracy laser beam positioning, precision material-independent autofocus, controllable laser power density, an automation interface, camera registration, an integrated touch screen control panel, over temperature detection, and support for fire suppression.
The ULTRA R5000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs.
The ULTRA R5000 platform has a materials processing envelope of 32 x 24 in (813 x 610 mm), with support for materials with a thickness up to 12 in (305 mm).
Configure the customizable ULTRA R5000 platform with up to two laser sources consisting of two interchangeable CO2 lasers or one CO2 laser and one fiber laser. When the platform is configured with two lasers users can take advantage of MultiWave Hybrid™ technology enabling up to two of three wavelengths from 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial beam. Each spectral component of the beam is independently controlled and can be modulated in real time.
Major features and options include multiple laser support, rapid laser beam positioning, precision material-independent autofocus, controllable laser power density, automation interface, multi-camera vision & registration, over temperature detection, and support for fire suppression.
The ULTRA R9000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs.
The ULTRA R9000 platform has a materials processing envelope of 48 x 24 in (1219 x 610 mm), with support for materials with a thickness up to 12 in (305 mm).
Configure the customizable ULTRA R9000 platform with up to two laser sources consisting of two interchangeable CO2 lasers or one CO2 laser and one fiber laser. When the platform is configured with two lasers users can take advantage of MultiWave Hybrid™ technology enabling up to two of three wavelengths from 9.3 µm, 10.6 µm, and 1.06 µm – to be simultaneously combined into a single coaxial beam. Each spectral component of the beam is independently controlled and can be modulated in real time.
Major features and options include multiple laser support, rapid laser beam positioning, precision material-independent autofocus, controllable laser power density, automation interface, multi-camera vision & registration, over temperature detection, and support for fire suppression.
One Touch Laser are proud to offer the entire range from Universal Laser Systems. Please Contact Us for more information.